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Solder Paste 42g XGSP50 Sn63/Pb37 Solder Paste Flux Mobile PCB 2PCS
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Mechanic 183℃ High Temperature XGSP4O Solder Paste Flux Tin Cream
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Mechanic 183℃ High Temperature XGSP4O Solder Paste Flux Tin Cream
Paste Content: Alloy Tin 63% Pb 37%, Sloder Flux Content: 10.5% Product Parameters: Total Weight: 29g, Net Weight Of Paste: 20g Paste Features: No
Sn63/Pb37 T4 Tin Lead Solder Paste No Clean, 183℃ Melting Point (20g)
10cc Sn63/pb37 Tin Solder Paste Syringe High Viscosity 183°c - Temu
10cc Sn63/pb37 Tin Solder Paste Syringe High Viscosity 183°c - Temu
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MECHANIC XG50 XGSP50 Sn63/Pb37 Solder Tin Paste Melting Point 183℃ Soldering Flux Paste For Phone PCB Board SMD Chips Repair