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In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore's Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.
In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore's Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.
李宗浩 posted on LinkedIn
Intel Is Throwing The Kitchen Sink, But Is The Turn Around Plan Reasonable?
SemiAnalysis の記事を眺めていると、学びしかない - Vengineerの戯言
SemiAnalysis の記事を眺めていると、学びしかない - Vengineerの戯言
一部予約販売 洋書 Foldable & Flex and Pouch Digital Thinned - Packaging Silicon X-Pac™ Multichip Digital Pack Technology (Emerging Technology Project in Advanced Pack) flexible 洋書
SemiAnalysis の記事を眺めていると、学びしかない - Vengineerの戯言
SemiAnalysis: Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of Economic Semiconductor Scaling, Heterogeneous Compute, and Chiplets : r/hardware
Charlie Zhou on LinkedIn: Yield is critical on cost, disaggregated have other benefits
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