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a) Under-bump metallization and micro-bumps fabricated on the VLSI

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Carbon Nanotubes as Microbumps for 3D Integration

Flip-Chip Interconnections: Past, Present, and Future

Roshanak SHAFIIHA, Staff Engineer, PhD, R&D

Micro Bump System for 2nd Generation Silicon Interposer with GPU

Roshanak SHAFIIHA, Staff Engineer, PhD, R&D

Stevan DJORDJEVIC, Principal Silicon Photonic Engineer

Multiple System and Heterogeneous Integration with TSV-Interposers

Process and Key Technology of Typical Advanced Packaging

Metals, Free Full-Text

Metals, Free Full-Text