4.6 (724) · $ 19.00 · In stock
Carbon Nanotubes as Microbumps for 3D Integration
Flip-Chip Interconnections: Past, Present, and Future
Roshanak SHAFIIHA, Staff Engineer, PhD, R&D
Micro Bump System for 2nd Generation Silicon Interposer with GPU
Roshanak SHAFIIHA, Staff Engineer, PhD, R&D
Stevan DJORDJEVIC, Principal Silicon Photonic Engineer
Multiple System and Heterogeneous Integration with TSV-Interposers
Process and Key Technology of Typical Advanced Packaging
Metals, Free Full-Text
Metals, Free Full-Text