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Deformation behavior of graphite and its effect on microstructure
Micromachines, Free Full-Text
Cross-sectional SEM images of thermal-aged samples.
Defective crescent bonds. (a) Lift off. (b) Excessive wire
Comparison of Insulated with Bare Au Bonding Wire: HAZ Length
Comparison and mechanism of electromigration reliability between
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Electrochemical and biological characterization of Ti–Nb–Zr–Si
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Deformation-induced localized solid-state amorphization in
Definition of Lots for Study B.
PDF) Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump