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Deep Reactive Ion Etching (DRIE) - Oxford Instruments
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography
Figure 1 from Ultra Deep Reactive Ion Etching of High Aspect-Ratio
Micromachines, Free Full-Text
Micromachines, Free Full-Text
PDF) Metal assisted chemical etching for high aspect ratio
PDF) Metal assisted chemical etching for high aspect ratio
Micromachines, Free Full-Text
Micromachines, Free Full-Text